Product type: Backplane
Material: FR4 S1000-2
Layer: 16L
Board thickness: 5.0mm
Minimum hole diameter: 0.3mm
Surface treatment: ENIG
Line space/width: 5/5mil
Technical feature: Oversize backplate, backplane technology, HDI, high diameter ratio, staircase groove
Application field: Photovoltaic
Core Strengths
● Full QTY one-off on time delivery over 95%
● Enquiries and consultion response within 2 hours
● Management team are industry veteran, management experience in 6 years
● In strict accordance with the military standard quality control. Obtainde GJB.9001B-2009
● The best cost performance in the field of PCB
● Improved production requirements have response capability
Material in stock
FR4, Flex PCB, Rigid-Flex PCB, AL base PCB, Cooper base PCB, Ceramic base PCB and HDI heavy cooper PCB are our main products. High frequency or microwave PCB, Rogers, Taconic, Alron also could be supplied.
PCB Capability | ||||
Layer Count |
Up to 30L |
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Max PCB size |
457mm*610mm |
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Min core Thickness |
0.1mm |
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Max Board thickness |
8.0mm |
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Min Board thickness |
0.3mm |
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Max Cu Thickness |
8OZ |
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Min line width/spacing |
3mil/3mil (Inner layer 18um , outer layer 12um) |
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Max Aspect Ratio |
14:1 |
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Min finished holes size |
Min CNC drilling size |
6mil |
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Min laser Drilling |
4mil |
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Min soldermask dam |
3mil |
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HDI capability |
3+N+3 |
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Surface treatment |
OSP/HASL/LF HASL/ENIG/Immersion Tin/Immersion Silver/Hard gold plating/ |
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Impedance control |
±10% |
±5%(Need assessment) |
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Outline Tolerance |
+/-4mil |
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Thermal Shock Test |
280℃, 20 seconds |
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E-Test Voltage: |
10V-250V |
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Warpage |
≤0.7% |
Certified
Product certification: UL (No.E333158)
Management system certification: ISO9001, GJB 9001B-2009, IS014001, IAFT 16949
http://www.sprintpcbsz.com/